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報名TIEC赴矽谷計畫:
第一、二類-報名截止日期 5/4
第三類-報名截止日期 4/25

報名投資媒合會- 報名截止日期 4/25
General Information

Team Members
Category 
Pitch Deck Upload
Please upload your Pitch Deck, preferably in PDF, Word or PPT file, and upload in Rar. or Zip file, maximum 3MB. You can also attach a cloud sharing linkage.
US Business Trip Plan upload
Optional, submit for startup teams to apply for TIEC subsidy program.
Video Link
2min. video link for fundraising.
是否申請輔導機構
回傳切結書說明
新創公司/團隊切結書 點此閱讀
新創公司/團隊切結書 點此下載
 
請詳細閱讀所有細項,並下載"新創公司/團隊切結書"文件。
確認完成表格填寫後,請經由上方上傳功能上傳DOC,DOCX.PDF,ZIP,RAR等格式的檔案。
Notice
The above information will be reviewed by the investors. The event provides an opportunity to meet with the investors yet no guarantee for the results of both parties.
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報名截止